LIGHT-EMITTING DIODE DEVICE Russian patent published in 2007 - IPC H01L33/00 

FIELD: electronic engineering.

SUBSTANCE: proposed device has substrate, one or more light-emitting chips with ohmic contacts, desired layout of interconnections between light-emitting chips on substrate, transparent cover whose outer surface is made in the form of body of revolution and inner one incorporates cavities, each accommodating light-emitting chip with relevant connecting components disposed at respective point of substrate. Introduced in at least one of cover cavities is immersion dispersed medium of light-dissipating particles. Substrate has two holes disposed on cavity periphery and used for filling this cavity with immersion dispersed medium. Particle size is 1 to 10 μm. Phosphor particles can be added to immersion dispersed medium.

EFFECT: facilitated assembly of light-emitting diode device, enhanced luminous efficiency.

3 cl, 2 dwg, 1 tbl