FIELD: confectionery industry, in particular, equipment for determining adhesion strength and coefficient of outer friction occurring upon offsetting of wafer sheet over wafer filler.
SUBSTANCE: apparatus has plate with reservoir immovably fixed thereon by means of stops. Reservoir is adapted for storage of wafer filler and is equipped with cover. Plate with wafer sheet retaining needles is connected to weight system onto which two loading plates are put. Plate with wafer sheet fixed to it is driven for progressive motion in horizontal plane. Geometric sizes of reservoir and wafer sheet are correlated according to predetermined functions. Adhesion strength of wafer sheet with respect to wafer filler and wafer sheet outer friction coefficient relative to wafer filler are determined by set formulas. Sizes of loading plates should correspond to sizes of plate with needles and sizes of wafer sheet. Length of needle part protruding from plate should not exceed thickness of wafer sheet.
EFFECT: wider operational capabilities of apparatus and provision for reliable controlling of adhesion strength to, thereby, improve quality of wafer product.
2 dwg
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| CONFECTIONER'S GOODS | 2007 |
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