FIELD: cooling of radio-electronic equipment elements.
SUBSTANCE: in a device composed of a thin-wall metal vessel divided into compartments parallel to the placement plane of cooled radio-electronic elements that are filled with fuse fillers with various fusioning temperatures increasing towards the placement plane of cooled radio-electronic elements, at the boundary of two compartments filled with fuse fillers with various fusioning temperatures evaporating sections of heat pipes are located parallel to the placement plane of cooled radio-electronic elements with thermal contact ensured between them and the fillers. Condensing zones of heat pipes are oriented transversely to the placement plane of cooled radio-electronic elements along two opposite side surfaces of said thin-wall metal vessel.
EFFECT: speeding up the process of cooling and filler hardening without applying any additional power consumption due to the use of heat pipes.
2 dwg
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Authors
Dates
2008-05-10—Published
2007-02-22—Filed