FIELD: electricity.
SUBSTANCE: damped board contains printed circuit board and damping unit consisting of reinforcing layer made of structural material bonded with printed board by layer of viscoelastic material. Damping unit is performed as two-layer frame passing through fixing points of printed board and containing reinforcing layer and layer of viscoelastic material.
EFFECT: providing of printed boards damping with maximum saving of useful area; minimal increase of board mass and keeping damping properties in wide temperature range.
3 cl, 7 dwg
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|---|---|---|---|
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