RADIO ELECTRONIC ARMATURE Russian patent published in 1995 - IPC

FIELD: radio engineering. SUBSTANCE: heat-equalization design of device provides small response to vibration. This results in possibility to decrease effect of temperature and mechanical influences to damper unit in wide range of frequencies while movable units that response to vibration are eliminated. Radio electronic armature has parallel printed circuits and damper unit which is mounted before printed circuits. Damper unit has three layers. Middle layer is made as metal plate while two outer layers are made from heat- conducting, vibration-dampening material. These plates are positioned on two opposite sides of plate. Damper unit is connected to other sides of parallel printed circuits by its outer layers. EFFECT: increased heat transfer, increased equalization of temperature over surface of printed circuits, increased efficiency of damping to vibrations which affects in wide frequency range, decreased response to vibration, increased working area of printed circuits and size of radio engineering armature, increased use of space on printed circuits and volume of radio engineering armature for positioning radio electronic elements. 2 cl, 6 dwg