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2 337 799

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(51)

IPC

B23K35/24(2006-01-01)

B23K35/36(2006-01-01)

(21) (22)

Application

2006135897/02, 2006-10-10

(24)

Start date

2006-10-10

(22)

Actual filing date

2006-10-10

(45)

Published

2008-11-10

(72)

Inventor

Filippova Marina Jur'EvnaKachurin Sergej NikolaevichBalakaev Aleksandr SergeevichBokash Viktor DmitrievichSidel'Nikov Jurij Viktorovich

(73)

Holder

Ooo Sluzhba Elizavetinskogo Opytnogo Zavoda"

SOLDERING PASTE FOR SOLDERING IN REDUCING MEDIA Russian patent published in 2008 - IPC B23K35/24 B23K35/36

Abstract RU 2337799 C2

FIELD: technological processes.

SUBSTANCE: soldering paste consists of components in the following ratio, in wt %: copper oxide 5.0 - 15.0, copper oxide 60.0 - 70.0, iron oxide 1.0 - 2.0, surface active substance 0.12 - 0.20, ammonium boron fluoride 0.13 - 0.20, ethylene glycol 7.5 - 9.5, water constitutes the remaining percentage ratio. The size of the copper oxide grains does not exceed 1.0 mcm. The copper oxide is obtained using an electrochemical method.

EFFECT: higher quality of soldering.

2 cl, 2 tbl

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RU 2 337 799 C2

Authors

Filippova Marina Jur'Evna

Kachurin Sergej Nikolaevich

Balakaev Aleksandr Sergeevich

Bokash Viktor Dmitrievich

Sidel'Nikov Jurij Viktorovich

Dates

2008-11-10—Published

2006-10-10—Filed