SOLDERING AND TIN-PLATING PASTE Russian patent published in 1995 - IPC

FIELD: electronic industry. SUBSTANCE: paste contains the following components, wt. glycerin ether of colophony 3.0-4.5, oleate of amino alcohol 0.8-2.5, polyethylene glycoladipinate 0.4-2.0, stearic acid 0.8-2.5, triethanolamine abietinate 0.8-2.5 n-undecylic alcohol 0.4-2.0, powder the rest. The shelf life of the paste is seven months. It can be applied in the pulse mode during the period of not less than 24 hours without separating into layers. EFFECT: enhanced productivity of soldering at the expense of feeding the paste with frequency 0.1-4 s without its separating into layers. 1 tbl