SOLDERING PASTE BINDER Russian patent published in 2012 - IPC B23K35/24 

FIELD: chemistry.

SUBSTANCE: invention relates to soldering, particularly to composition of soldering paste for soldering and tin coating at temperature of up to 350°C. The soldering paste binder contains glycerine, sorbite and an activating additive. The activating additive contains a salt which is formed by an alkali and an organic acid or a weak inorganic acid, with the following ratio of components, wt %: glycerine - 38-42, sorbite - 35-55, activating additive - 3-27. The activating additive used can be an acetate - sodium acetate or a carbonate - sodium carbonate.

EFFECT: enabling soldering at temperatures of up to 350°C by raising the heat stability of the binder to oxidation and high quality of solder joints and enabling complete wash off of binder residues with water after soldering.

3 cl, 3 tbl, 2 ex