FIELD: radio electronics.
SUBSTANCE: in multilayer printed circuit board, which contains layers with pattern of conductors and dielectric gaskets installed between them, from glass fibre impregnated with compound on the basis of epoxide resin, which differs by the fact that into impregnating compound methacrylic acid and unsaturated oligoether are introduced at the following ratio of components, wt % - Epoxide resin 15÷17 Methacrylic acid 3÷5 Unsaturated oligoether 79÷81.
EFFECT: increase of circuit board quality by improvement of dielectric properties.
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