FIELD: manufacturing technology.
SUBSTANCE: invention relates to a method of producing gaskets, gluing based on epoxy resins and glass fabrics, used for making multilayer printed-circuit boards, including flexible-rigid. To produce gluing gasket solvents – mix of toluene and acetone in ratio 1:1, tetramethylsilane are mixed in mixer. Epoxy resin is added to mixture of solvents after their mixing with mixer. Then spherical particles of butadiene-nitrile-styrene-carboxylate polymer, silicone substance, 4,4'-diaminodiphenylsulphone and acetylacetonate are added. Components are further stirred at temperature of 20–30 °C until complete dissolution of epoxy resin. Obtained solution impregnates glass fabric, followed by drying at temperature 240–243 °C for 4–4.5 minutes.
EFFECT: improved properties of the manufactured gluing insert, expressed in reduction of warping of the multilayer printed-circuit board made by pressing the gluing spacer between the layers of the board at temperature (185±1) °C for 2 hours and pressure of 12 MPa occurring after exposure to temperature (204±1) °C for 600±6 s, buckling does not exceed 0,1 mm.
1 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
GLUING GASKET SFU | 2014 |
|
RU2574758C1 |
METHOD FOR FUSING GASKET MANUFACTURE | 2016 |
|
RU2641831C1 |
GLASS TEXTOLITE SFU | 2014 |
|
RU2582706C1 |
ADHESIVE CUSHION SFG | 2013 |
|
RU2550383C2 |
GLASS FIBRE SFG | 2013 |
|
RU2561976C2 |
EPOXY-COMPOSITION | 0 |
|
SU654647A1 |
BINDER COMPOSITION FOR FLAKY INSULATING MATERIAL | 1993 |
|
RU2041896C1 |
BINDER COMPOSITION FOR LAYERED INSULATING MATERIAL | 1994 |
|
RU2047627C1 |
EPOXY COMPOSITION | 0 |
|
SU840073A1 |
PROCESS OF MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARDS | 1994 |
|
RU2064736C1 |
Authors
Dates
2019-05-28—Published
2018-04-24—Filed