FIELD: manufacturing technology.
SUBSTANCE: invention relates to a method of producing gaskets, gluing based on epoxy resins and glass fabrics, used for making multilayer printed-circuit boards, including flexible-rigid. To produce gluing gasket solvents – mix of toluene and acetone in ratio 1:1, tetramethylsilane are mixed in mixer. Epoxy resin is added to mixture of solvents after their mixing with mixer. Then spherical particles of butadiene-nitrile-styrene-carboxylate polymer, silicone substance, 4,4'-diaminodiphenylsulphone and acetylacetonate are added. Components are further stirred at temperature of 20–30 °C until complete dissolution of epoxy resin. Obtained solution impregnates glass fabric, followed by drying at temperature 240–243 °C for 4–4.5 minutes.
EFFECT: improved properties of the manufactured gluing insert, expressed in reduction of warping of the multilayer printed-circuit board made by pressing the gluing spacer between the layers of the board at temperature (185±1) °C for 2 hours and pressure of 12 MPa occurring after exposure to temperature (204±1) °C for 600±6 s, buckling does not exceed 0,1 mm.
1 cl, 2 tbl
| Title | Year | Author | Number | 
|---|---|---|---|
| GLUING GASKET SFU | 2014 | 
 | RU2574758C1 | 
| METHOD FOR FUSING GASKET MANUFACTURE | 2016 | 
 | RU2641831C1 | 
| GLASS TEXTOLITE SFU | 2014 | 
 | RU2582706C1 | 
| ADHESIVE CUSHION SFG | 2013 | 
 | RU2550383C2 | 
| GLASS FIBRE SFG | 2013 | 
 | RU2561976C2 | 
| EPOXY-COMPOSITION | 0 | 
 | SU654647A1 | 
| BINDER COMPOSITION FOR FLAKY INSULATING MATERIAL | 1993 | 
 | RU2041896C1 | 
| BINDER COMPOSITION FOR LAYERED INSULATING MATERIAL | 1994 | 
 | RU2047627C1 | 
| EPOXY COMPOSITION | 0 | 
 | SU840073A1 | 
| PROCESS OF MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARDS | 1994 | 
 | RU2064736C1 | 
Authors
Dates
2019-05-28—Published
2018-04-24—Filed