FIELD: technological processes.
SUBSTANCE: device contains matrix and puncheon fixed above it on the movable stem. Puncheon is equipped with punching circuit of open type, in rupture points of which needle heaters are installed. Specified version of device makes it possible to produce high-quality figured holes without film deformation.
EFFECT: provision of figured hole punching with open circuit in heat-sealing film without creation of its rupture zones with simultaneous preservation of package high quality.
3 cl, 4 dwg
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