FIELD: metallurgy.
SUBSTANCE: invention refers to methods of application of copper coating and can be implemented in electronic engineering. The method consists in cleaning and degreasing of material surface, in application of copper containing material on it by a mechanical method and in thermal treatment of the material by means of its heating in atmosphere of hydrocarbon combustion products. Also the copper containing material is applied on the surface; the said material is applied in form of a fine dispersed powder of copper borates CuB2O4 or Cu3B2O6.Thermal treatment is carried out at the temperature of 500-600°C.
EFFECT: fabrication of hard copper coating on surface of wide range of materials.
1 ex
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