FIELD: electronics and other industry branches needing use of conductive coating on dielectric material, possibly microelectronics technologies, particularly manufacture of microstripe-line microwave devices. SUBSTANCE: copper coating is applied onto dielectric at using copper-containing materials such CuB2O4 and Cu3B2O6 in monocrystalline and in vitrous state. Coating is formed by heat treatment of materials in atmosphere of combustion products of gas burner. EFFECT: simplified techniques for applying uniform-thickness high-strength chemically pure coating. 1 ex
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Authors
Dates
2002-09-10—Published
2000-10-30—Filed