METHOD FOR APPLYING COPPER COATING ONTO DIELECTRIC MATERIAL Russian patent published in 2002 - IPC

Abstract RU 2188879 C2

FIELD: electronics and other industry branches needing use of conductive coating on dielectric material, possibly microelectronics technologies, particularly manufacture of microstripe-line microwave devices. SUBSTANCE: copper coating is applied onto dielectric at using copper-containing materials such CuB2O4 and Cu3B2O6 in monocrystalline and in vitrous state. Coating is formed by heat treatment of materials in atmosphere of combustion products of gas burner. EFFECT: simplified techniques for applying uniform-thickness high-strength chemically pure coating. 1 ex

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RU 2 188 879 C2

Authors

Sablina K.A.

Volkov N.V.

Petrakovskij G.A.

Dates

2002-09-10Published

2000-10-30Filed