FIELD: chemistry.
SUBSTANCE: invention refers to methods formation of component coating by chemical conversion for dielectrics, semiconductors and electronegative metals (iron, aluminium, titanium and their alloys), as well as combined ceramic-metal materials and can be used in radio engineering industry, in instrument engineering and for manufacturing of printed-circuit boards and decoration of wax, plastisol and other products. The first version of the method involves component surface processing in sorption stabilising solution in ratio as follows, g/l: SiO2 - (35-45)×10-3, Al2O3 - (0.5-10)×10-3, MgO - (0.5-10)×10-3, HF - (0.5-1)×10-3, water - the rest. It is followed with sensitisation, activation in solution containing palladium chloride and hydrochloric acid, and metal plating. The second version of the method involves sensitisation of component surface in sorption stabilising solution in ratio as follows, g/l: SiO2 - (35-45)×10-3, Al2O3 - (0.5-10)×10-3, MgO - (0.5-10)×10-3, HF - (0.5-1)×10-3, water - the rest.
EFFECT: improved plating quality ensured with higher catalytic activity of processed surface and reduced palladium content in solution for activation.
2 cl, 8 tbl, 8 ex
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Authors
Dates
2009-03-27—Published
2007-05-22—Filed