FIELD: electric equipment.
SUBSTANCE: invention concerns method of connector soldering to electroconductive structure in manufacturing of transparent laminated parts. Method involves first glass sheet preparation with electroconductive structure applied to its surface and featuring contact surface. First connector part is positioned above contact surface together with solder alloy layer. Second glass sheet is positioned above first connector part to form pre-assembled unit. Second connector part protrudes beyond glass sheets. Pre-assembled unit is heated to temperature higher than solder alloy melting point to melt solder alloy, and cooled down to solidify solder alloy layer, and electric contact to conductive structure through second connector part is established.
EFFECT: method of soldering without separate soldering stage and thus preventing local glass heating leading to glass damage.
29 cl, 7 dwg, 4 ex
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