FIELD: physics.
SUBSTANCE: in method of obtaining of hermetic detachable joint of case and cover of electronic module by means of sealant disposed in furrow in a part contacted to cover of the case, groove executed along end face of walls of the case with a prominence of the first wall of groove from the interior of the case over the second wall of groove from an outer side of the case, charge to level of the second wall of groove with the plastic sealant possessing adhesion to material of the case and cover and ability to hardening as a result of vulcanisation or drying. The specified sealant then at superimposition of cover on end face of walls is partially superseded by the dilatational salient of cover executed on its perimeter, from groove in upper site of working backlash between the first wall of groove and interior wall of cover salient.
EFFECT: increase of hermetic sealing efficiency of electronic modules, magnification of term of maintenance of tightness of modules, expansion of dimensional interval of electronic modules sealed by offered expedient as a result of decrease in requirements to effort of fixture by means of detachable joint in connection with lack of necessity of deforming of elastic sealant and select of plastic sealant possessing good adhesion to material of case of module and ability of solidification.
5 cl, 1 dwg
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Authors
Dates
2009-04-10—Published
2007-04-18—Filed