LOW-PRESSURE PLATING PROCESS Russian patent published in 2009 - IPC C25D5/08 

Abstract RU 2352692 C1

FIELD: chemistry.

SUBSTANCE: low-pressure component plating process in electrolysis with electrolyte circulation involves plating process ensured in a bath or out-bath plating cell with continuous, unidirectional and rate-regulated electrolyte circulation enabled by connecting the bath or the cell to two equivalent tanks. Electrolyte from the tanks is supplied in turn to the bath or the cell under atmospheric pressure in one tank and low pressure in the other one, while synchronous changeover of the tanks as well as the pressure are regulated with distributing valves automatically.

EFFECT: higher metallic power yield, considerably improved plating uniformity, better adhesion, stabilised temperature conditions in the working bath with complete cleaning of sucked gases from electrolyte vapour and complete elimination electrolyte discharge into the atmosphere.

5 dwg

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RU 2 352 692 C1

Authors

Stratulat Mikhail Parfent'Evich

Dates

2009-04-20Published

2007-06-27Filed