FIELD: electroplating, namely application of copper coatings on steel without intermediate layer. SUBSTANCE: electrolyte for bright copper plating contains, g/l: copper sulfate, 30-50; alkali metal pirophosphate, 120-180; alkali metal biphosphate, 70-100; hydrogen absorption inhibitor - phenylhydrazone 3-(α-quinacsolonyl)-acetophenone, (10-4-10-3)mol/l; and brightening agent - phthalimide, (10-4-10-3) mol/l. Such electrolyte provides formation of high-quality electroplated deposits being poreless and having small-crystal structure, spicular surface, good adhesion, minimum hydrogen absorption of steel base. EFFECT: improved content of electrolyte. 3 tbl
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