FIELD: technological processes.
SUBSTANCE: invention may be used for soldering of plate-finned and tubular heat exchangers in vacuum, for instance in aircraft engine engineering and other fields of machine building. Connected parts are serially heated in vacuum by means of scanning laser beam to the temperature of solder melt and are further cooled. At every stage heating is carried out till the temperature of change of phase condition of powdery solder components with a delay after every heating stage. At the first stage heating is carried out up to the temperature of binding solder decomposition. At the second stage solder is heated up to temperature of powder sintering, at the third stage - to solidus temperature, at the fourth stage - to liquidus temperature of solder. Uniformity of temperature field on surface of soldered parts is controlled remotely by infrared imager and is corrected when necessary.
EFFECT: provides for quality of soldering items with deep through channels with powdery solders.
3 cl, 1 dwg
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Authors
Dates
2009-07-27—Published
2007-11-15—Filed