ADHESIVE COMPOSITION Russian patent published in 2010 - IPC C09J163/00 

FIELD: chemistry.

SUBSTANCE: invention relates to cold hardening structural adhesives with high strength of adhesive joints during shift, tearing and peeling, high water resistance and high elasticity, with retention of elastic and strength properties under effect of repeated temperature fluctuations from 40°C to +120°C. The adhesive composition contains epoxy diane resin ED-20, polyamide resin, a hardener, organosilicon amine. The organosilicon amine is selected from a group containing bisparaaminophenyleneaminomethyl - methyldisiloxane, γ-amino-propyltriethoxysilane, 1-aminohexamethylene-6-aminomethylenetriethoxyaminosilane, diethylaminomethylenetriethoxysilane or their mixture. The composition also contains a modifier - polysulfone (heat-resistant thermoplastic polymer) and filler. The hardener used is an adduct of phenol, ethylenediamine, formaldehyde AF-2. The mineral filler used is schungite crumbs with particle size not greater than 40 mcm. The adhesive composition is prepared by successively mixing the components.

EFFECT: shorter hardening time, increased elasticity, impact viscosity during repeated temperature fluctuations from -40°C to +120°C.

1 ex, 2 tbl