FIELD: chemistry.
SUBSTANCE: adhesive composition of cold hardening includes epoxy diane resin (90-110 wt.p.), polyamide resin (35-55 wt.p.) organic-silicon amine, selected from the group including bis-para-amino-phenylene-aminomethylene-tetramethyl-disiloxane, γ-aminopropyl-triethoxy-aminosilane, 1-aminohexamethylene-6-aminomethylene-triethoxy-aminosilane, diethyl-aminomethylene-triethoxy-silane or their mixtures (1.15-1.30 wt.p.), a thermoplastic modifier polyetherimide (5-25 wt.p.), a hardening agent diethylene-triaminomethyl-phenol UP-583D (25-35 wt.p.) and a mineral filling agent chrysotile A-4-5 (20-30 wt.p.).
EFFECT: invention makes it possible to obtain adhesive compounds, possessing high shear strength, tearing strength and peel strength, higher water resistance, crack resistance, high elasticity, with the preservation of elastic and strength properties under an impact of multiple temperature fluctuations.
2 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
ADHESIVE COMPOSITION | 2008 |
|
RU2383574C1 |
GLUING COMPOSITION | 2003 |
|
RU2261885C2 |
ADHESIVE COMPOSITION | 2003 |
|
RU2266942C2 |
ANTIFRICTION COMPOSITION FOR COATING OF SLIDING FRICTION UNITS | 0 |
|
SU1742284A1 |
EPOXIDE GLUE COMPOSITION | 2007 |
|
RU2368636C2 |
EPOXYPOLYURETHANE GLUEING COMPOSITION | 0 |
|
SU1835424A1 |
ADHESIVE EPOXIDE COMPOUND | 2011 |
|
RU2457231C1 |
COMPOSITION FOR PROTECTIVE COVER | 2005 |
|
RU2290421C1 |
COMPOUND | 2015 |
|
RU2613987C2 |
CURRENT-CONDUCTING ADHESIVE COMPOSITION | 2005 |
|
RU2308105C1 |
Authors
Dates
2014-09-10—Published
2013-02-11—Filed