COMPOSITION FOR HEAT-CONDUCTING ADHESIVE COMPOUND Russian patent published in 2015 - IPC C09J163/00 C08L63/00 

FIELD: chemistry.

SUBSTANCE: group of inventions relates to versions of heat-conducting cold curing epoxy adhesive compositions with high adhesion strength, which are intended for joining metals (steels, aluminium and titanium alloys), ceramics, carbon fibre, while facilitating heat removal from heated structural components. The heat-conducting adhesive compound is intended for removing heat from heated structural elements to instrument panels for maintaining given thermal operating conditions of on-board equipment in aviation and space equipment. Said adhesive should therefore provide the technical result - curing at the temperature of the manufacturing facility (25±10°C) and characterised by minimal gas emission under vacuum-heat action according to GOST R 50109-92. The composition for the heat-conducting adhesive compound (version 1) contains an epoxy diane resin, an aliphatic amine, a low-molecular weight polyamide resin and heat-conducting filler - boron nitride, and additionally contains triglycidyl ether of trimethylolpropane and diglycidyl ether, with the following ratio of components, pts.wt: epoxy diane resin - 10.0-30.0; triglycidyl ether of trimethylolpropane - 0-20.0; diglycidyl ether - 20.0-30.0; aliphatic amine - 0.6-13.0; low-molecular weight polyamide resin 20.0-50.0; boron nitride - 65-90. The composition for the heat-conducting adhesive compound (vesion 2) contains epoxy diane resin, an aliphatic amine, a low-molecular weight polyamide resin and heat-conducting filler - boron nitride, and additionally contains diglycidyl ether, with the following ratio of components, pts.wt: epoxy diane resin - 30.0; diglycidyl ether 30.0; aliphatic amine - 0.6-13.0; low-molecular weight polyamide resin 20.0-50.0; boron nitride - 65-90.

EFFECT: improved properties of the composition.

2 cl, 6 ex