FIELD: chemistry.
SUBSTANCE: invention relates to polymer compositions for adhesive paste. Described is a polymer composition for adhesive paste containing the following, in pts. wt: epoxide diane chlorine-containing resin EKD 65-70; phenol-formaldehyde resin SF-010 35-45; oligourethanediepoxide PPG-ZA 3-5.
EFFECT: composition increases wear-resistance and heat-resistance of hardened material, with retention of high adhesion strength and stability of tribotechnical characteristics.
1 cl, 1 tbl, 3 ex
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Authors
Dates
2010-05-10—Published
2008-05-27—Filed