FIELD: process engineering.
SUBSTANCE: invention relates to powder metallurgy, particularly to method of producing copper-based composite materials. It can be used for production of electric contacts. Powders of graphite, copper, aluminium, phosphor copper and copper oxide are mixed at the following ratio, wt % graphite 0.10-0.20; aluminium 0.20-0.30; phosphor copper 0.05-0.15; copper oxide 1.15-1.4; copper making the rest. Prepared mix is subjected to high-power treatment in ball mill to produce granules of material representing copper-based matrix with reinforcing particles uniformly distributed therein in amount of 0.35 to 0.55 wt % of total weight with average size of 0.1 to 0.5 mm. Material matrix represents α-Cu(Al) substitutional solution while reinforcing particles - γ-Al2O3 with average size of 20-40 nm. Mix is compacted by extruding in heated state.
EFFECT: high electric arc wear, temperature of loss of strength and electric conductivity.
1 dwg, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
COPPER-BASE DISPERSION-HARDENED MATERIAL FOR WELDING | 1996 |
|
RU2103134C1 |
PRODUCTION OF COPPER-BASED COMPOSITE FOR ELECTRIC CONTACTS | 2014 |
|
RU2567418C1 |
METHOD OF MAKING COMPOSITE MATERIAL FOR ELECTRIC BREAKING CONTACTS AND MATERIAL | 2017 |
|
RU2691452C1 |
WEAR-RESISTANT COMPOSITE POWDER MATERIAL ON COPPER BASE FOR CONTACT PLATES OF CURRENT COLLECTORS OF ELECTRIC STOCK | 2008 |
|
RU2400550C2 |
DISPERSEDLY HARDENED COMPOSITION MATERIAL | 1996 |
|
RU2113529C1 |
COMPOSITE MATERIAL OF CONTACT PLATE ON COPPER BASIS AND METHOD OF ITS MANUFACTURING | 2007 |
|
RU2368462C2 |
COPPER-DISPERSED HARDENED COMPOSITE MATERIAL | 2020 |
|
RU2740677C1 |
METHOD TO PRODUCE POWDERED COMPOSITE Cu-Cd/Nb FOR ELECTROCONTACT APPLICATION | 2013 |
|
RU2516236C1 |
METHOD OF MANUFACTURE OF COPPER-BASED COMPOSITE MATERIAL AND COMPOSITE MATERIAL MANUFACTURED BY THIS METHOD | 2001 |
|
RU2202642C1 |
METHOD FOR MANUFACTURE OF HIGH-TEMPERATURE AND HEAT-RESISTANT DISPERSION-HARDENED COPPER-BASE ARTICLES | 1997 |
|
RU2117063C1 |
Authors
Dates
2010-09-10—Published
2009-07-23—Filed