MANUFACTURING METHOD OF PRECISION CHIP RESISTORS AS PER HYBRID TECHNOLOGY Russian patent published in 2010 - IPC H01C17/06 H01C17/28 

FIELD: electricity.

SUBSTANCE: method involves the following process operations: 1) application to ground (rear) surface of insulating substrate by means of screen-printing technique of layer of silver or silver-palladic paste with its further baking, thus forming electrode contacts on rear side of substrate; 2) sputtering of resistive layer to polished (front) side of insulating substrate by means of vacuum (thin-film) technique; 3) formation of resistive layer topology on substrate by means of photolithography and ion etching; 4) application of low-temperature silver paste with its further baking on front side of substrate above resistive layer by means of screen-printing technique, thus forming electrode contacts on front side; 5) adjustment of resistance value of resistors to nominal by means of laser adjustment; 6) application of low-temperature protection paste layer by means of screen-printing technique to resistive layer with further baking, thus forming protective layer; 7) scribing and breakage of plate of insulating substrate into strips; 8) sputtering of nickel-chrome alloy to the edges by method of vacuum (thin-film) procedure, thus connecting electrode contacts of front and rear sides of substrate to each other; 9) breakage of rows of plate into chips; 10) application of nickel layer by galvanic method above electrode contacts - edge one, on front and rear sides; 11) application of solder metal layer above nickel layer by galvanic method in the form of alloy of stannum with plumbum.

EFFECT: improving operating reliability of precision chip resistors.

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