METHOD FOR MAKING THICK-FILM RESISTIVE ELEMENTS Russian patent published in 2013 - IPC H01C17/06 

FIELD: electricity.

SUBSTANCE: method for making thick-film resistive elements involves series application of conducting and resistive layers to an insulating substrate using a screen printing method with its further burning-in in air atmosphere. the proposed method involves alternation of application of a conducting layer with its burning-in on individual sections of the insulating substrate, at the temperature of 840-860°C during 55±5 minutes; then, application of a resistive layer and its burning-in at the temperature 805±2°C is performed step by step during 70±5 minutes with further control of nominal of resistive elements; with that, at increased nominal, fitting is performed at the temperature of 820±10°C during 5-10 minutes, and at decreased nominal at the temperature of 690±10°C during 5-10 minutes; after that, tin plating is performed in molten solder by dipping at the temperature of 250±10°C.

EFFECT: improvement of quality of resistive layer surface and radiotechnical characteristics of devices with such a film resistor.

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