THICK-FILM RESISTOR FABRICATION METHOD Russian patent published in 2015 - IPC H01C17/00 

FIELD: electricity.

SUBSTANCE: in this method of fabrication of thick-film resistors which includes consecutive application by the screen printing method on the isolating substrate of conducting and resistive layers with subsequent drying and burning-in in the air atmosphere, on the resistive layer in addition the main protective layer is applied using the screen printing method with subsequent burning-in. After laser adjustment of resistance of resistors an additional protective layer is applied using the screen printing method. The female contacts are formed by depositing of nickel layer with titan sublayer with the subsequent hot tinning with solder.

EFFECT: increase of output of suitable resistors with simultaneous improvement of technical characteristics of resistors.

2 cl, 1 dwg, 2 tbl