FIELD: physics.
SUBSTANCE: method may involve wearing (202) high-temperature plastic (122) around multiple connector pins (112) to form a base part (120), wearing (204) low-temperature plastic (132) around the base part to form an insertion (130), wearing (206) side pieces (142) of the connector along the perimetre of the insertion to form an interface node (140), and welding (212) the insertion to the housing (151) for movement (153) of the low-temperature plastic into the housing using ultrasound.
EFFECT: provision for interface connections with high degree of wholeness.
14 cl, 11 dwg
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