FIELD: metallurgy.
SUBSTANCE: invention relates to electroplating, in particular, to electrolytic deposition of bismuth-gallium alloy. Proposed electrolyte comprises, in g/l: bismuth chloride - 30-40, gallium chloride - 1-5, ammonium chloride - 20-30, trilon B 35-45, equaliser A 1.5-2.5.
EFFECT: uniform and smooth coats with high micro hardness and corrosion resistance.
1 tbl, 3 ex
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR DEPOSITING ARGENTUM-BISMUTH ALLOY | 2002 |
|
RU2215067C1 |
| BISMUTH-TIN ALLY PRECIPITATION ELECTROLYTE | 1999 |
|
RU2164967C1 |
| ELECTROLYTE FOR DEPOSITION OF NICKEL-BISMUTH ALLOY | 2011 |
|
RU2457287C1 |
| ELECTROLYTE FOR PRECIPITATION OF COBALT-BISMUTH ALLOY | 2001 |
|
RU2197567C1 |
| ELECTROLYTE FOR DEPOSITING ZINC-GALLIUM ALLOY | 2011 |
|
RU2459016C1 |
| ELECTROLYTE FOR DEPOSITION OF BISMUTH-THALLIUM ALLOY | 2005 |
|
RU2291917C1 |
| ELECTROLYTE FOR DEPOSITING BISMUTH-CADMIUM ALLOY | 1998 |
|
RU2139370C1 |
| ELECTROLYTE FOR DEPOSITION OF ALLOY LEAD-INDIUM | 2007 |
|
RU2343233C1 |
| ELECTROLYTE FOR DEPOSITION OF BISMUTH-MANGANESE ALLOY | 1997 |
|
RU2116389C1 |
| ELECTROLYTE FOR DEPOSITION OF CADMIUM-ANTIMONY ALLOY | 2002 |
|
RU2236487C1 |
