FIELD: electricity.
SUBSTANCE: piezoelectric drive with 3D packet piezoelement for installation on basic structure has at least one surface of packet piezoelement, which is exposed to 2D or 3D profiling perpendicularly to layers of packet, and this at least one profiled surface is fit to circuit of basic structure, at which drive should be installed.
EFFECT: invention provides for high capacity of piezoelement and piezoelectric drive with simultaneous elimination of piezoelement damage risk in process of installation onto part.
17 cl, 12 dwg
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