FIELD: non-destructive testing methods.
SUBSTANCE: invention relates to piezo-package non-destructive testing methods and assessment of quality of their component parts gluing. Proposed method consists in supply of voltage of variable frequency to input of piezo package and measurement of current intensity. Current frequency is varied in the range of the first overtone of piezoelectric cell 2.5ƒLres<ƒ<2.7(ƒUres+Δƒmax), where Δƒmax=ƒa-ƒres – maximum value of antiresonance frequency difference ƒa and resonance ƒres of piezoelectric elements, ƒLres and ƒUres – lower and upper frequencies of radial resonance, measuring active Gp and reactive Bp components of current to voltage ratio with frequency step of not more than 1 kHz, determining according to AFC active conductivity component bandwidth Δƒ0.5Gp=ƒU0.5Gp – ƒL0.5Gp, where ƒU0.5Gp and ƒL0.5Gp – upper and lower frequencies, and by AFC of the reactive component of conductivity – a sign of this value and the satisfactory quality of the piezo package is stated by meeting two conditions: inequality Δƒ0.5Gp≤(ƒUres – ƒLres)/2.6 and presence of change of positive sign of value Bp to negative value.
EFFECT: elimination of difficulties of reliable interpretation of control results.
1 cl, 1 tbl, 5 dwg
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Authors
Dates
2020-08-17—Published
2019-12-12—Filed