FIELD: chemistry.
SUBSTANCE: invention can be used to obtain permanent joints between different materials, particularly for low-temperature fluxless soldering ceramics and metal using diffusion-hardening solders based on gallium. The components of the solder are in the following ratio, wt %: gallium 32-45; copper-silver alloy 8-12; aluminium oxide 0.5-3; zinc 3-7; brass - the rest. The brass contains zinc in amount of up to 37 wt %, with copper making up the remaining amount.
EFFECT: solder increases strength of the soldered joint.
2 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
SOLDER FOR FLUXLESS SOLDERING | 2006 |
|
RU2317882C1 |
SOLDER FOR FLUX-FREE SOLDERING AND METHOD FOR ITS MANUFACTURE | 2015 |
|
RU2609583C2 |
FLUX-FREE SOLDER | 2012 |
|
RU2498889C1 |
FLUX-LESS SOLDERING SOLDER | 0 |
|
SU607685A1 |
COPPER-BASE SOLDER | 2004 |
|
RU2279957C1 |
0 |
|
SU291769A1 | |
SOLDER | 0 |
|
SU1706816A1 |
SOLDER FOR SOLDERING METALS AND STEELS | 0 |
|
SU1763133A1 |
SOLDER FOR TINNING AND SOLDERING ALUMINIUM AND ITS ALLOYS | 0 |
|
SU1774907A3 |
TUBULAR SOLDER COMPOSITION FOR SOLDERING COPPER AND ALLOYS | 0 |
|
SU882086A1 |
Authors
Dates
2011-10-27—Published
2010-05-28—Filed