FIELD: process engineering.
SUBSTANCE: invention relates to soldering by gallium-based diffusion-curable solder and can be used for making permanent bonds of different materials, in particular, for low-temperature flux free soldering of metals and ceramics with metals. Solder to this end comprises copper, gallium and tin. Note here that it contains copper with particle size of 25-45 mcm and gallium-tin alloy at definite ratio of components.
EFFECT: low-viscosity high setting rate solder for flux-free soldering.
4 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDER FOR FLUXLESS SOLDERING | 2006 |
|
RU2317882C1 |
| SOLDER FOR FLUX-FREE SOLDERING AND METHOD FOR ITS MANUFACTURE | 2015 |
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RU2609583C2 |
| SOLDER FOR FLUXLESS SOLDERING | 2010 |
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RU2432242C1 |
| FLUX-LESS SOLDERING SOLDER | 0 |
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SU607685A1 |
| THE METHOD OF FLUX-FREE SOLDERING OF DISSIMILAR MATERIALS | 2010 |
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RU2442680C1 |
| SOLDER FOR FLUXLESS SOLDERING | 1992 |
|
RU2012468C1 |
| 0 |
|
SU550259A1 | |
| SOLDER FOR SOLDERING ALUMINUM AND ITS ALLOYS WITH COPPER AND ITS ALLOYS WITHOUT FLUX | 0 |
|
SU1785859A1 |
| SOLDER FOR FLUXLESS TINNING OF ALLOYS TERBIUM-IRON | 0 |
|
SU1590295A1 |
| DIFFUSION-HARDENING SOLDER | 2010 |
|
RU2438844C1 |
