FIELD: metallurgy, soldering materials.
SUBSTANCE: invention proposes a solder comprising the following components, wt.-%: beryllium, 1.65-2.0; manganese, 0.5-0.7; titanium, 0.3-0.5; nickel, 0.2-0.4; iron, 0.15-0.25; magnesium, 0.1-0.2; aluminum, 0.1-0.15; silicon, 0.1-0.15, and copper, the balance. The solder provides strength and vacuum density of soldered joints at exploitation heating below 650°C and shows technological effectiveness in making the deformed semifinished articles from it as foil and wire. Invention can be used in soldering different beryllium compounds with structural alloys - stainless steel and monel used as mandrel in making roentgen windows.
EFFECT: improved and valuable properties of solder and articles.
2 tbl, 3 ex
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR MANUFACTURING A VACUUM-TIGHT BERYLLIUM OUTLET WINDOW | 2021 |
|
RU2760320C1 |
| METHOD OF MAKING VACUUM-TIGHT OUTLET BERYLLIUM WINDOW | 2023 |
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RU2815735C1 |
| PROCESS OF OBTAINING QUICK-RESISTANT BORON-FREE SOLDER NICKEL BRAZING PRODUCTS FROM CORROSIVE-STEEL, SOLDER, PEAK CONNECTION AND METHOD OF ITS OBTAINING | 2015 |
|
RU2625924C2 |
| SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF | 2014 |
|
RU2584357C1 |
| AMORPHOUS COPPER-BASED STRIP SOLDER | 2011 |
|
RU2464143C1 |
| SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF | 2014 |
|
RU2585598C1 |
| SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF | 2014 |
|
RU2596535C2 |
| NICKEL BASE SOLDER | 2004 |
|
RU2278011C1 |
| METHOD OF PRODUCING AIRTIGHT CERAMIC-METAL SEAL USING COMPENSATING ELEMENT | 2010 |
|
RU2455263C2 |
| HETEROGENEOUS ACTIVE SOLDER FOR SOLDERING OF METAL-CERAMIC AND CERAMIC VACUUM-DENSE COMPOUNDS | 2019 |
|
RU2717766C1 |
