SOLDER FOR FLUXLESS SOLDERING Russian patent published in 2008 - IPC B23K35/26 

FIELD: mechanical engineering; soldering.

SUBSTANCE: invention relates to soldering by diffusion-hardening solders on gallium base and it can be used to form nondetachable joints of different materials, for particularly, for low-temperature fluxless soldering of cermet with metals. Proposed solder includes gallium, copper-tin alloy, size of particles 40-60 mcm and copper-silver alloy, size of particles 5-10 mcm at the following ratio of components, mass %: gallium 45-50, copper-silver alloy 8-12, the remainder being copper-tin alloy. Use of filler in form of two-fraction mixture of alloy powders with indicated size of particles provides high mechanical strength of solder owing to reduction of inner porosity at high freezing rate.

EFFECT: provision of high mechanical strength of solder.

2 cl, 1 tbl