PROCEDURE FOR MANUFACTURE OF FOIL FOR FLEXIBLE PRINTED CIRCUIT BOARDS OF TWO-PHASE MICRO-COMPOSITE MATERIALS ON BASE OF COPPER Russian patent published in 2011 - IPC C22F1/08 H01K1/02 C22C49/00 

FIELD: metallurgy.

SUBSTANCE: here is disclosed procedure for manufacture of foil for flexible printed circuit boards of two-phase micro-composite materials on base of copper. The procedure consists in melting ingots of two-phase alloys on base of copper, in forming a composite blank of micro-composite material and in its rolling. There are melted ingots of two-phase alloy Cu - Me, where Me is metal of group having volume-centred cubic grating, Nb, Fe, Cr, V, Ta. Further ingots are deformed into rods of cross dimension 500-1000 mcm. There is formed a composite blank of micro-composite material by assembling rods into a package and by arranging in a copper matrix at distance of 1000-3000 mcm from each other. Rolling is performed in two stages. At the first stage there is carried out cold or warm rolling with amount of passes facilitating manufacture of plates of the second phase of 50-100 mcm thickness, while at the second stage - cold rolling with manufacture of plates of the second phase of 5-10 nm thickness placed in the copper matrix at distance of 30-100 nm along direction of rolling with volume share as high, as 30%.

EFFECT: manufacture of foil, material of which possesses high strength and fatigue properties at maintaining high electric conductivity.

3 cl, 2 dwg, 1 tbl