FIELD: electricity.
SUBSTANCE: thermal distributor consists of a first surface having a thermal contact with an electronic component, and an opposite second surface having a thermal contact with a heat spreader belonging to a group including coolers on heat pipes and water coolers. The following ratios of dimensions of the thermal distributor are observed: T/(√S) ≥0.17, where T is a thickness of the given thermal distributor and (√S) is a square root of a surface area of the first surface of the given thermal distributor. Besides, the invention refers to electronic systems including the given thermal distributor.
EFFECT: thermal distributor has the optimal ratio of dimensions to provide optimal parameters of heat resistance and acoustic noise abatement generated by a cooler fan for improving temperature modes of the electronic components composing these electronic systems.
11 cl, 8 dwg
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