SYSTEM OF AIR COOLING OF HEAT RELEASE ELECTRONIC MODULES Russian patent published in 2012 - IPC H05K7/20 H01L23/467 

FIELD: electricity.

SUBSTANCE: system of air cooling of electronic modules comprises a tight heat exchanger body with ribbed walls at the outer side, a chamber for arrangement of heat release electronic modules, an air duct for cooling air flow, besides, ribbed walls are made as hollow ribs with formation of chambers for arrangement of electronic modules, where heat-stressed elements of the electronic modules have thermal contact with the inner wall of the chamber, the electric connection between the electronic modules is arranged by flexible printed circuit boards and/or electric connectors, and the outer space between hollow ribs forms an air duct for cooling air flow.

EFFECT: development of a noiseless efficient and reliable system of air cooling of electronic modules arranged in a tight body with provision of electronic modules protection against electromagnetic noise.

2 dwg