FIELD: electric engineering.
SUBSTANCE: invention may be used for efficient scattering of heat in radio-electronic units operated under conditions of severe mechanical and climatic impacts (high temperature and moisture, dynamic shocks, etc.). Unit modules are connected by at least two connecting circuit boards and through slots of modules, besides heat-loaded and non-heat-loaded modules are arranged at the distance from each other in separate bodies.
EFFECT: improved efficiency of heat scattering in radio-electronic unit.
3 cl, 3 dwg
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