MULTILAYER PRINTED CIRCUIT BOARD Russian patent published in 2012 - IPC H05K3/46 H05K9/00 

Abstract RU 2444162 C2

FIELD: electricity.

SUBSTANCE: in a multilayer printed circuit board comprising signal dielectric layers that include a topological pattern of printed wiring alternate with screening layers made in the form of a lattice equipped with printed conductors that follow configuration of the topological pattern of the neighbouring signal layer, and the signal conductors are placed with account of radiation they generate.

EFFECT: improved quality of printed circuit board protection against exposure to electromagnetic fields.

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RU 2 444 162 C2

Authors

Skachkov Sergej Anatol'Evich

Rebrov Anatolij Semenovich

Esin Jurij Ivanovich

Kljuev Aleksej Vasil'Evich

Dojko Oleg Leonidovich

Dates

2012-02-27Published

2008-02-18Filed