FIELD: electronics; printed circuit boards.
SUBSTANCE: multilayer printed circuit board consisting of signal dielectric layers comprising topological patterns of the printed wiring and interchanging with screening layers having the form of a grid provided with printed conductors reflecting the topological pattern configuration of their nearest signal layer. Top layers of said printed circuit board are covered with a protection coat that consists of a mixture of ferrite powder and plastic binder based on protective varnishes or compounds and is applied by means of spreading, immersion or spraying.
EFFECT: enhancement of the quality of printed circuit board protection against effects of EMI.
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