FIELD: printing industry.
SUBSTANCE: structure of a multi-layer printed circuit board consists of signalling dielectric signal layers comprising topological pattern of printed assembly, alternating with shielding layers made of a grid which is provided with printed conductors tracking the configuration of the topological pattern of the adjacent signal layer. The outer layers are covered with a double layer protective coating consisting of a mixture of ferrite powder with a polymeric binder. The concentration of ferrite powder in the layers of the protective coating is different, at that the layers are applied so that their contact surface, in cross-section in any direction, has a sawtooth configuration.
EFFECT: improvement of quality of protection of printed circuit boards from EMF exposure, providing improved electromagnetic compliance of the printed circuit board with other devices.
1 dwg
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