EPOXY COMPOSITION FOR POLYMERISATION AND SEALING COMPOUND CONTAINING SAID COMPOSITION Russian patent published in 2012 - IPC C08G59/04 C08G59/24 C08G59/66 C09K3/10 G02F1/1339 H01L51/50 H05B33/04 

Abstract RU 2444538 C1

FIELD: chemistry.

SUBSTANCE: epoxy composition for polymerisation contains (A2) a fluorene epoxy compound of formula

,

(A3) an epoxy compound with softening point of 30°C or lower, and (B) a thiol compound containing two or more thiol groups per molecule. As one version, the composition contains a curing accelerator or a curing accelerator and a silane modifier. The group of inventions also includes a transparent resin for optical materials (versions), a sealing compound (versions), a hardened article (versions), a method of producing the epoxy composition for polymerisation, an optical device and an organic EL display.

EFFECT: article made from the composition has high refraction index and high heat-resistance; by sealing an optical device with the epoxy composition for polymerisation, light-harvesting efficiency can be improved and moisture penetration into the device can be prevented.

25 cl, 3 dwg, 17 ex

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RU 2 444 538 C1

Authors

Takamatsu Jasusi

Jamamoto Jugo

Ito Juiti

Dates

2012-03-10Published

2009-01-23Filed