FIELD: chemistry.
SUBSTANCE: epoxy composition for polymerisation contains (A2) a fluorene epoxy compound of formula
,
(A3) an epoxy compound with softening point of 30°C or lower, and (B) a thiol compound containing two or more thiol groups per molecule. As one version, the composition contains a curing accelerator or a curing accelerator and a silane modifier. The group of inventions also includes a transparent resin for optical materials (versions), a sealing compound (versions), a hardened article (versions), a method of producing the epoxy composition for polymerisation, an optical device and an organic EL display.
EFFECT: article made from the composition has high refraction index and high heat-resistance; by sealing an optical device with the epoxy composition for polymerisation, light-harvesting efficiency can be improved and moisture penetration into the device can be prevented.
25 cl, 3 dwg, 17 ex
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POLYMER COMPOSITION | 0 |
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SU663315A3 |
Authors
Dates
2012-03-10—Published
2009-01-23—Filed