FIELD: physics.
SUBSTANCE: frame set has a mounting board for mounting circuit elements thereon and a frame for supporting the mounting board. On the mounting board, the surface of the substrate on which circuit elements (25) are mounted is a circuit element mounting surface. One surface of the frame (11U) opposite the mounting surface for circuit elements has depressions (13) which are formed to accommodate respective circuit elements (25). Accommodating spots (13) for accommodating circuit elements (25) are formed for the respective circuit elements (25) in an opposing surface (11U), which is one surface of a backlight frame (11) opposed to a circuit element mounting surface (23B) on which the circuit elements (25) are mounted.
EFFECT: ensuring uniform heat distribution of the frame when releasing heat remaining in a circuit element and in the mounting board into the frame.
8 cl, 14 dwg
