FIELD: physics.
SUBSTANCE: semiconductor device consists of a chip having a chip pattern with confidential data, a housing, inserts made from material with shape memory effect placed under the chip pattern at the mechanically weak point, and a polymerised filler. When subjected to special reverse engineering techniques, that region containing confidential data will be destroyed.
EFFECT: protection of chip pattern regions containing confidential data from reverse engineering through mechanical destruction of that area of the pattern containing confidential information.
3 cl, 2 dwg
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