LOOSE SEALING STRUCTURE (VERSIONS), LOOSE SEAL, AND PACKING SYSTEM Russian patent published in 2012 - IPC B65B51/02 B65B51/06 

Abstract RU 2461499 C2

FIELD: transport, package.

SUBSTANCE: proposed structure comprises thermoplastic polymer and organic clay dispersed in, at least, portion of thermoplastic polymer. Said loose structure comprises sealing layer that makes sealing surface. Sealing surface may form loose seals at all temperatures within temperature range of said loose seal. Note here that seal temperature range varies from sealing initiation temperature to that, at least 100°F higher than the former. Said sealing initiation temperature varies from 170°F to 350°F. Organic clay comprises plates separated by at least 20 Angstroem units. Sealing surface features mean roughness of 1500-5000 Angstroem units. Sealing layer features modulus of tension of 500-2000 MPa. In compliance with another version, proposed structure comprises thermoplastic polymer and organic clay dispersed in, at least, portion of thermoplastic polymer. Note here that organic clay features surface area exceeding 100 m2/g and aspect ratio exceeding 10. Loose seal comprises sealing surface at contact with sealing back layer at all aforesaid temperatures. Note here that seal temperature range varies from sealing initiation temperature to that, at least 100°F higher than the former. Said sealing initiation temperature varies from 170°F to 350°F. Sealing surface features mean roughness of 1500-5000 Angstroem units. Sealing layer features modulus of tension of 500-2000 MPa. Packing system comprises container and loose sealing section glued to said container and provided with sealing back layer and first sealing layer. Note here that first sealing layer is arranged, at least, partially above back layer to stay in contact therewith. Said first sealing layer comprises thermoplastic polymer and organic clay dispersed in, at least, portion of thermoplastic polymer. Note also that loose sealing structure makes sealing surface to create loose seal on back layer surface at all aforesaid temperatures. Note here that seal temperature range varies from sealing initiation temperature to that, at least 100°F higher than the former. Said sealing initiation temperature varies from 170°F to 350°F. Organic clay comprises plates separated by at least 20 Angstroem units. Sealing surface features mean roughness of 1500-5000 Angstroem units. Sealing layer features modulus of tension of 500-2000 MPa.

EFFECT: higher quality.

31 cl, 29 dwg, 6 tbl

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RU 2 461 499 C2

Authors

Kinigakis Panagiotis

Pokusa Kennet

Albaum Gari

Dates

2012-09-20Published

2007-09-28Filed