FIELD: chemistry.
SUBSTANCE: resin contains a main component and a modifier. The main component contains at least one colophony-based resinous substance, having circular and spherical softening temperature of about 85-125°C. The modifier contains at least one colophony-based resinous substance having low softening temperature. The resin is characterised by circular and spherical softening temperature, with mean softening temperature of about 35-60°C. The resin is part of the composition of the pressure-sensitive hot-melt adhesive, which has a first component which is at least one styrene-butadiene block-copolymer and a second component which is at least one styrene-isoprene-styrene block-copolymer or a mixture of styrene-isoprene-styrene and styrene-isoprene block-copolymers. The pressure-sensitive hot-melt adhesive composition is used for an adhesive article having a front surface made from paper and cardboard materials and materials made from polymer films.
EFFECT: pressure-sensitive hot-melt adhesive composition has good tackiness, high cohesion strength and good rheological properties.
10 cl
