FIELD: transport, package.
SUBSTANCE: packing casing for silicon has multilayer structure where multiple packing bags are used. Each of packing bags has bottom part and multiple side parts. Bottom part contains lower pressed part and folded part over mentioned pressed lower part. Lower parts are overlapped over each other with corresponding folded parts of mutually offset packing bags. Folded parts of packing bags are located primarily throughout bottom part of packing casing.
EFFECT: invention provides elimination of vibration, friction between silicon and packing bag and fine powder creation.
7 cl, 10 dwg
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Authors
Dates
2012-10-10—Published
2008-08-25—Filed