METHOD OF MAKING HEAT-DISSIPATING PANEL, HEAT-DISSIPATING PANEL MADE USING SAID METHOD, PANEL-FORMED STRUCTURE AND HEAT-DISSIPATING SYSTEM Russian patent published in 2012 - IPC H05B3/86 

Abstract RU 2467519 C2

FIELD: physics.

SUBSTANCE: method of making a heat-dissipating panel 100, having a configuration wherein an electroconductive thin layer 120 is provided on at least one surface of a transparent sheet 110 and the electroconductive thin layer 120 releases heat when electric energy is transmitted to it, for example, for windows. The method involves fixing a metal strip 132 on the electroconductive thin layer 120 formed on the sheet 110 along each of the opposite sides of the sheet 110; depositing an electroconductive paste 134 on top of each metal strip 132 in order to coat said metal strip; bringing into contact the heat-dissipating part 220 of the heating device 200 on edges which form two sides of the sheet 110, where the metal strip 132 is fixed, in a state in which temperature of the heat-dissipating part 220 is higher than the given temperature; the heat-dissipating part 220 is longer than at least the full length of the metal strip 132; and hardening the electroconductive paste 134 to form electrodes having a metal strip and electroconductive paste 134; and electrically connecting the wire lead 140 with each of the electrodes 130.

EFFECT: invention enables to make a heat-dissipating panel with low current consumption and fewer connected wires.

9 cl, 12 dwg

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RU 2 467 519 C2

Authors

Dammura Josikazu

Ito Tosiaki

Savada Takakazu

Khino Ehtsuo

Khonda Jasutosi

Okuno Gaku

Jamanaka Katsunobu

Tanaka Munejuki

Dates

2012-11-20Published

2008-07-08Filed