FIELD: physics, computers.
SUBSTANCE: proposed device comprises first container with fusible heat-retaining material (HRM) intended for contact with processor, on one side, and with cold side of thermoelectric module (TEM), on the other side. Second container with HRM is arranged in contact with TEM hot side. Melting point of second HRM exceeds that of the first container. Note that fan is arranged on the side of second container heat sink.
EFFECT: higher efficiency of cooling.
7 cl, 1 tbl, 3 dwg
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